Maradin’s MEMS scanning mirror chips – the Heart of Future Miniature Laser Projection Systems
Maradin’s offering is a fully integrated solution, designed to serve as the very core of miniature laser projection systems.
Effectively a self-contained scanning module, it comprises a two dimensional MEMS scanning mirror (MEOMS) and an integrated electronic chip (ASIC) as MEMS driver and controller, along with video signal synchronization. Both these components are tightly embedded in extremely compact form via wafer-level packaging techniques, which also contribute significantly to the module’s small footprint and modest cost, especially in mass production scenarios.
Maradin’s unprecedented design represents numerous ground-breaking innovations in the field of micro-mirror actuation and control. This company’s unique intellectual property enables the implementation of miniature projection systems capable of projecting both interlaced and progressive scan video and images in SVGA resolution, while eliminating inherent scanning distortions and utilizing laser projection for high optical accuracy and overall system power efficiency.
The MEMS Scanning mirror Chip
Maradin’s MEMS scanner architecture is based on a 2D gimbaled mirror, with two uncoupled actuators. Each actuator is designed to enable DOF (Degree Of Freedom) on separate axes, with the X (horizontal scan) axis utilizing an electrostatic resonating actuator, and the Y (vertical scan) axis implementing an electromagnetic actuator. The scanning mirror yields a greater than 90% reflection ratio.
The MEMS Driver and controller Chip (ASIC)
The electronic component of the integrated module utilizes all of the advanced microelectronics required to perform both analog and digital electronic tasks within Maradin’s single ASIC, which is responsible for the following:
- Full 2D feedback control
- X axis actuator and Y axis motor transport
- Synchronization of both axes with data to be projected
- Power management and conditioning
- Interfacing with outer world
Both MEMS scanner and MEMS driver are integrated in a single multi-chip package featuring an optical aperture for the mirror. The optical aperture is implemented via a plastic cover, placed over the scanner chip to protect it from dust and handling. This packaging format is painstakingly designed to achieve a very slim (less than 5 mm) form factor, so as to facilitate integration within the current state-of-the-art of mobile phones and smartphones, with no compromises in functionality whatsoever.
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